DeviceNet Master Module: IC694DNM200

The DeviceNet Master Module allows the CPU to send and receive dataover a DeviceNet network. It can act as master for up to 63 slaves on theDeviceNet network. It can also be configured to simultaneously functionas a slave to another master on the bus.DeviceNet is a communications network that transmits data betweencontrol systems (for example: PLCs, PCs, VMEbus computers, and robotcontrollers) and distributed industrial devices such as switches, sensors,valve manifolds, motor starters, bar code readers, drives, displays, andoperator interfaces.

This module can be installed in any available I/O slot in any RX3i orSeries 90-30 backplane. It is compatible with PACSystems™ RX3iIC695CPU310 CPU, release 3.5 or later. It is also compatible with anySeries 90-30 CPU except IC693CPU321 or IC693CPU340 with release8.0 or later CPU firmware. Release 10 or later is recommended. MachineEdition Logic Developer PLC version 3.0 SP1 Special 2 or later isrequired. This module is not compatible with VersaPro™, Control, orLogicmaster™ programming software. A Series 90-30 Hand-HeldProgrammer (IC693PRG300) cannot be used for configuration.

Technical specifications for IC695CPU310

Catalog Numbers	IC693DNM200, IC694DNM200
Description	Master Module for DeviceNet networks
Mounting Location Series 90-30	Series 90-30 main rack: Any slot except slots 0 and 1.
PACSystems RX3i	RX3i main rack: Any slot except slot 0.
	DeviceNet Master modules cannot be installed in remote or expansion racks.
Environment	Storage temperature: -40ï‚°C to 85ï‚°C Operating temperature: 0ï‚°C to 60ï‚°C
Backplane Current Consumption	450mA at 5VDC (typical)
Data rates	Supports all standard DeviceNet data rates (125K, 250K, and 500K Baud)

Product Description

IC694DNM200 sell

The IC694DNM200 is a DeviceNet Master module. This module is an option communication module that is part of the PACSystem RX3i Programmable Automation Controller (PAC) platform. It is installed to any vacant slot of an RX3i baseplate at enables communication to the DevieNet network. Being a master DeviceNet master module, this module is used to communication to DeviceNet, supporting up to 63 DeviceNet slaves. With the use of the IC694DNM200, Distributed I/O architecture can be implemented. Up to 63 I/O stations can be configured with each station exchanging information at configurable speeds of 125k, 250k, or 500k baud and with maximum data that be exchanged amounting to 255 Bytes of input and 255 Bytes of output for every slave device. In addition, each master module is capable of communicating up to maximum of 3972 bytes of input data and 3972 bytes of output data. Configurable connection types include Polled, Cyclic, Strobe or Change of State (COS). It also supports Unconnected Message Manager (UCMM) with one proxy connection per slave. The IC694DNM200 is powered by the backplane therefore, no external power is required. It has power consumption amounting to 450mA at 5VDC (typical). It supports trunkline or dropline topology however, redundancy is not supported. It has One (1) DeviceNet terminal which supports used of thick and thin communication cables. Cables must be of common axis with drain wire in the center. This module is not only compatible for use in an RX3i backplane but to a Series 90-30 baseplate as well. The firmware of this module can also be modified by upgrading to newer release. This can be done through the RS232 Service port.

Frequently asked questions

Q: How many DeviceNet devices can the module manage?

A: The IC694DNM200 supports up to 63 nodes on a single DeviceNet network.

Q: Is the module compatible with non-GE Fanuc devices?

A: Yes, it complies with ODVA DeviceNet standards, ensuring compatibility with a wide range of third-party devices.

Q: What diagnostics are available on this module?

A: The module features diagnostic LEDs for power, module status, and network activity, along with error codes for troubleshooting.

Q: Can this module be used in hazardous environments?

A: The module is not specifically rated for hazardous locations. Use additional protective enclosures as needed.

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